GTDM-1 DC magnetron sputtering coating device
Foreword
Magnetron sputtering technology is developed on the basis of ordinary DC sputtering technology. Early DC sputtering techniques used ion bombardment of targets generated by glow discharges to achieve thin film deposition. However, this sputtering technique has a low film formation rate and a high working pressure (2 to 10 Pa). In order to increase the film formation rate and lower the working pressure, a magnetic field is applied to the back side of the target, which is the original magnetron sputtering technique.
Magnetron sputtering method adds a magnetic field perpendicular to the electric field in the cathode pole region, and the electrons make a whirling motion in a direction perpendicular to the electric field and perpendicular to the magnetic field. The trajectory is a round rolling line, which increases the electrons and charging. The probability of particles and gas molecules colliding increases the ionization rate of the gas and lowers the working pressure. At the same time, the electrons are constrained to the vicinity of the target surface and do not reach the negative (positive) pole, thereby reducing the electron-on-substrate. The bombardment reduces the temperature rise of the substrate due to electron bombardment.
When DC magnetron sputtering is used, there is not much problem for preparing a metal film, but for the insulating material, arc discharge and "microdroplet sputtering" phenomenon occur, which seriously affects the stability of the system and the quality of the film. In order to solve this problem, RF magnetron sputtering technology is adopted, so that the target and the substrate are equivalent to a charge and discharge process of a capacitor in the RF magnetron sputtering process, thereby overcoming the arc discharge caused by charge accumulation and The occurrence of the "microdroplet sputtering" phenomenon.
Main use: This equipment is mainly used in universities and colleges to research and develop nano-scale single-layer films; such as various hard film, metal film and other film materials. Direct sputtering can be performed, and reactive sputtering can also be achieved.
Main features: simple structure, easy operation, convenient vacuum maintenance, safe and reliable.
Installation environment requirements
The coating machine should be installed in a clean, dust-free, non-corrosive gas room with a clean water source and a stable voltage of 220V.
1. The basic level of the ground should be adjusted and must not be uneven;
2. Ambient temperature: 10 ° C ~ 30 ° C;
3. Relative humidity: no more than 75%;
4. Water consumption: about 0.2T/h;
5, water quality requirements: tannic acid hardness <6 degrees, PH value: 7-8, conductivity: 200us / cm, deposition rate: <200mg / L.
6, voltage: 220V, 50Hz, voltage fluctuation range: 198 ~ 231V; frequency fluctuation range: 49 ~ 51Hz;
7, water pressure: 0.3 ~ 1Kg / cm2 or 0.03 ~ 0.1MPa / cm2;
8. Filling gas with a purity of 99.9% or more;
9. The purity of the coating consumables is 99.9% or more.
Equipment specification
1. Sputtering treatment room:
1) Bell jar: inner diameter 225mm × height 260mm;
2) Sample table: diameter 80mm (maximum);
3) Sample rotation: stationary;
4) Baffle: manual;
5) Substrate heater: stainless steel heater (DC24V);
6) substrate temperature range: room temperature to 200 ° C;
7) Adjustable distance of substrate: 20mm~60mm;
8) Ultimate vacuum of sputtering chamber: 6.7×10-1 Pa
2. Vacuum system:
1) Exhaust system: a primary vacuum system consisting of a mechanical pump;
Pumping rate: 4L/S
2) Vacuum detection: resistance vacuum gauge, resistance gauge;
3) Common vacuum: 1~20Pa
4) Operation: Manual
3. Sputtering power supply:
1) Sputtering power supply: no-load voltage: ≥1000V,
Working voltage: 200 ~ 800V Power: 1KW
2) Power supply: AC 220V;
3) Cooling method: air cooling;
4, magnetic control target:
1) Target diameter: Ф50mm, permanent magnet target;
2) Target thickness: 3 ~ 6mm;
5, intake system: 2 rotor flow meter intake
6, power requirements: AC 220V 50Hz 10A
7, gas requirements: argon - purity 99.9% (use high purity gas when special requirements)
8, cooling requirements: target water cooling, sputtering power supply air cooling
9, volume and weight: volume: L550mm × W680mm × H1480mm; about 120kg
Equipment composition
The DHRM-1 RF magnetron sputtering coating device is mainly composed of the following seven parts:
1. Sputter processing chamber;
2. Vacuum system;
3. Operation control system;
4. The whole machine power supply system;
5, the inflation system (user-supplied);
6. Substrate heating system;
7. Target cooling water system.
Equipment structure
1. Sputtering chamber: in the bell jar above the cabinet.
2, vacuum system: by mechanical pump, high vacuum manual flapper valve, bell jar, deflation valve,
Inflatable rotor flowmeter, resistance vacuum gauge and resistance gauge.
3. Electrical system: The electrical system is divided into control part and power supply part.
4. Cooling water system: consists of cooling water joints and inlet and outlet water lines.
5, aeration system: high purity argon along the argon cylinder - pressure reducing valve - conduit - rotor flow meter -
Catheter - sample sputtering chamber.
1. Sputtering treatment chamber 2. Vacuum control valve 3. DC sputtering power supply
4, control panel 5, power supply system 6, gas supply system
control panel
= 1 \* GB3 1 Resistance vacuum gauge = 2 \* GB3 2 Temperature controller = 3 \* GB3 3 DC power indicator
= 4 \* GB3 4 Water pressure indicator = 5 \* GB3 5 Alarm indication = 6 \* GB3 6 Mechanical pump power button
= 7 \* GB3 7 Sputtering power button = 8 \* GB3 8 Substrate heating power button = 9 \* GB3 9 Inflator power button
= 10 \* GB3 10 vacuum gauge power button
power supply system
= 1 \* GB3 1. Total power indicator = 2 \* GB3 2. Total power switch
= 3 \* GB3 3. Current indicator = 4 \* GB3 4. Voltage indicator
Resistance vacuum gauge
= 1 \* GB3 1 full scale adjustment = 2 \* GB3 2 zero adjustment
= 3 \* GB3 3J1, J2 output LED indicator = 4 \* GB3 4 vacuum measurement display window
Temperature Controller
= 1 \* GB3 1 Display window, display measured value PV, parameter name
= 2 \* GB3 2 Display window, display set value SV, alarm code, parameter value, etc.
= 3 \* GB3 3 Set button for entering parameter setting status, confirming parameter modification, etc.
= 4 \* GB3 4 Data shift key (start auto-tuning)
= 5 \* GB3 5 data reduction button
= 6 \* GB3 6 data increase button
= 7 \* GB3 7 LED indicators, OP1, AU1, AU2, RUN, etc. indicate output, auxiliary alarm output 1, 2 and running indicator respectively.
Basic display status: After the meter is powered on, the display window displays the measured value (PV), and the lower display shows the set value (SV). The display status is the basic display status of the meter. When the input measurement signal exceeds the range (such as the thermocouple disconnection), the upper display window alternately displays the word “orA†and the upper or lower measurement limit. At this time, the meter will automatically stop the control output.
DC power source
1, digital meter
= 1 \* GB3 1 voltage indication digital meter: unit V, indicating DC pulse output voltage;
= 2 \* GB3 2 current indication digital table: unit A, indicating DC pulse output current;
2, adjust the potentiometer
= 3 \* GB3 3 voltage adjustment potentiometer: adjust this potentiometer to change the output voltage, the starting point is the voltage output minimum value, and the adjustment terminal is the voltage maximum value (rated value);
= 4 \* GB3 4 current adjustment potentiometer: adjust this potentiometer to change the output current, the starting point is the current output minimum value, and the adjustment terminal is the current maximum value (rated value);
button
= 5 \* GB3 5 Remote/Local Control Button: Dual function button, press this button to change the power control mode. It is the local control and remote control conversion button. Look at the indicator light. Under normal circumstances, this button will be local when booting. Control mode, the indicator light is green. At this time, the remote start signal, shutdown signal, positive and negative pulses, voltage, current reference, frequency, and duty cycle given signals are invalid. Only the reset signal is valid, and you want to convert the remote control. As long as you press this button again, the indicator light is red, which is not only remote control. At this time, the power panel power-on button, power-off button, voltage and current adjustment potentiometer are invalid.
= 6 \* GB3 6 Power-on button: Single function button, press to turn on, the power-on indicator turns green, and the power is turned on;
= 7 \* GB3 7 Shutdown button: Single function button, press OFF, the shutdown indicator turns red, and the power is turned off;
= 8 \* GB3 8 Local reset button: Single function button, power failure, or cut-off protection, power supply sound, light alarm, press this button to reset. Before resetting, you must check the fault nature and protection category for processing. The reset button is a constant-key button and is not subject to local/remote control restrictions. If you press the reset button, it cannot be reset. This is because the fault point is not released, such as overheat protection. It can be reset after the temperature has dropped.
Vacuum sputtering chamber
= 1 \* GB3 1 glass bell jar = 2 \* GB3 2 thermocouple, substrate heating lead = 3 \* GB3 3 substrate heating station
= 4 \* GB3 4 Sputtering baffle = 5 \* GB3 5 Magnetic control target shield = 6 \* GB3 6 substrate box support rod
= 7 \* GB3 7 substrate box locking nut = 8 \* GB3 8 baffle shaft
Magnetron target
= 1 \* GB3 1 target fastening screw = 2 \* GB3 2 sputtering target
= 3 \* GB3 3 target compression ring = 4 \* GB3 4 sputtering target
device installation
1. Cleaning and installation of sputtering chamber:
Remove the plastic cover of the table disc and thoroughly clean the surface of all parts on the workbench and above, especially the vacuum seal groove on the workbench and the large rubber seal ring (ring ring) to meet the vacuum performance. Claim. All other sputtering chamber components should be thoroughly cleaned to meet high vacuum requirements and spare.
2, cover the bell:
The glass bell jar is cleaned, washed with water if necessary, and finally dehydrated with anhydrous ethanol, dried, and placed on a table disc.
3. Installation of mechanical pump:
Lift the mechanical pump to the back of the cabinet, use a vacuum bellows to connect the tube with the “exhaust port†on the rear panel, and connect the mechanical pump power supply to the terminal block marked “Mechanical pump†in the chassis. Just fine.
4. Cooling waterway installation: Use one end of the water pipe of φ16 to insert the water pipe joint marked with “water inletâ€, the other end is connected to the tap water pipe faucet and lock with the ferrule; use another φ16 water pipe at one end to insert the mark “ The water pipe joint marked by the water outlet is placed at the other end of the water drain; the waterway installation should be neat and there should be no water leakage.
5, gas cylinder installation (users install themselves).
After all parts and components have been installed, check one to two times, especially bolt fasteners and electrical parts. Repeated inspections should be repeated several times to confirm the correctness before testing.
Vacuuming procedure
Install the vacuum chamber according to the equipment installation procedure;
Before vacuuming, the equipment should be inspected thoroughly. All switches must be disconnected, and the air source should be connected. Connect the water source. It can be turned on after confirmation.
1. Close the = 2 \* GB3 2 main power switch on the "Power Supply System" panel, turn on the main power supply, = 1 \* GB3 1 The main power indicator lights up; = 3 \* GB3 3 current indicator, = 4 \* GB3 4 voltage indication table corresponding indication; at the same time on the "control panel" = 3 \ * GB3 3DC power indicator and = 4 \ * GB3 4 water pressure indicator lights;
If = 5 \* GB3 5 alarm indication alarm sounds, = 4 \* GB3 4 water pressure indicator is not lit; please check if the cooling water is connected!
2. Press the red button on the “Control Panel†= 6 \* GB3 6 mechanical pump power switch, the red light is on; start the mechanical pump; turn the “front valve†counterclockwise to pump the sputtering chamber; at the beginning, It is normal that a large amount of white smoke is discharged from the pumping port of the mechanical pump. At the beginning, the mechanical pump was heavy due to heavy load, loud noise, and large vibration, which is normal. After a few minutes of operation, the white smoke emitted by the mechanical pump will be reduced, the noise and vibration will be reduced, and the sound of the mechanical pump will give a beat and dry sound, indicating that the mechanical vacuum pump is normal. The soot of the mechanical pump must be discharged outdoors; (user-supplied)
3. Press the = 10 \* GB3 10 vacuum gauge power green button on the “Control Panelâ€; measure the vacuum in the sputtering chamber; continuously pump the air section to the background vacuum;
4. Prepare the sample; (Refer to DC magnetron sputtering for film preparation)
5. After the sample preparation is completed, turn off the RF power supply - mechanical pump - substrate heating (if open) - vacuum gauge;
6. Press the = 10 \* GB3 10 gauge green button on the Control Panel; the green light is on; after a few seconds delay, the bleed valve opens and begins to deflate.
7. The second batch of samples is repeatedly operated during processing.
Equipment maintenance
First, the maintenance of the vacuum chamber:
1. After coating, the inner surface of the container and the workpiece holder will be coated with a film layer. As the thickness of the film increases, more hidden gas molecules will be deposited between each film, and the film layer will be plated. The easier it is to adsorb the gas, the slower the pumping speed and the longer the duty cycle. Therefore, the container and the workpiece holder should be cleaned frequently to keep the studio clean.
2. After the daily work, take out the liner and baffle of the container and clean it;
3. After each film is finished, the film dust in the vacuum chamber must be cleaned with a vacuum cleaner;
Second, vacuum chamber substrate holder cleaning and installation requirements:
The substrate holder in the vacuum chamber must be periodically removed for cleaning due to the coating layer, otherwise the vacuuming time will be affected because the plating layer becomes thicker.
A, cleaning method:
1. Mechanical cleaning method: that is, manual polishing and polishing, and all the layers are removed.
2. Chemical cleaning method:
Stainless steel cleaning solution formula:
Hydrochloric acid (HCL) 5.5 parts; nitric acid (HNO3) 2 parts; water 2.5 parts by weight, plus 2 to 3% urea, temperature 70 ° C.
B. Cleaning process:
Remove the oil, immerse in the formula, the time should not be too long, the film layer can be removed, then rinse with tap water, 2 ~ 5% ammonia water, tap water rinse, anhydrous ethanol dehydration, drying.
The cleaning work must be taken seriously, and you cannot leave the job when it is not cleaned, otherwise the parts will be damaged.
Note: All parts must be thoroughly dried after they have been cleaned. Wear clean gloves or hand socks when installing.
Fourth, other maintenance considerations:
1. Keep the equipment clean and the working environment around the equipment must be kept clean and tidy;
2. Regularly check whether the waterway and gas path are unblocked. Note: Regularly remove scale from water pipes;
3. The vacuum chamber must be in a vacuum state after the equipment is used;
4. After the equipment is finished every day, vacuum the container to prevent dust and other dirt from entering the vacuum chamber, and prevent the container from being exposed to air to adsorb gas. Otherwise, the equipment work cycle will be lengthened;
5, the equipment should be connected to a good ground, and regularly check the ground resistance is qualified.
Reasons for the abnormality of the film layer and solutions
1. When the film is black:
a. It may be that the vacuum is too low when coating, and the working vacuum needs to be adjusted.
b. It may be that the vacuum chamber is leaking at the sealing position, and a full leak detection is required.
2. When the film is yellow:
a, it may be that the coating time is too long;
b. It may be that the coating current is too large and the coating process needs to be adjusted.
3. When the film is released from the film:
a, may be insufficient vacuum when coating, need to adjust the working vacuum;
b. It may be that the workpiece is not clean.
Preparation of thin film by DC magnetron sputtering
First, the purpose of the experiment
1. Master the basic principle of film formation by magnetron sputtering
2. Understand the operation process and scope of use of DC magnetron sputtering coating equipment
Second, the experimental principle
The principle of magnetron sputtering: electrons collide with argon atoms during the acceleration of flying into the substrate under the action of an electric field, ionizing a large amount of argon ions and electrons, and electrons fly to the substrate. The argon ions accelerate the bombardment of the target under the action of the electric field, and sputter a large number of target atoms, and a neutral target atom (or molecule) is deposited on the substrate to form a film. The secondary electrons are affected by the magnetic field Lorent magnetic force during acceleration to fly toward the substrate, and are bound to the plasma region near the target surface. The plasma density is high in this region, and the secondary electrons surround the magnetic field. The target surface is circularly moved. The movement path of the electron is very long. During the movement, it continuously collides with the argon atoms to ionize a large amount of argon ions to bombard the target. After multiple collisions, the energy of the electrons gradually decreases, and the magnetic line is bound. , away from the target, and finally deposited on the substrate. Magnetron sputtering is a magnetic field that binds and lengthens the moving path of electrons, changes the direction of electron movement, increases the ionization rate of working gas and effectively utilizes the energy of electrons. The home of electronics is not only the substrate, but also the vacuum indoor wall and the target anode. However, the substrate is generally at the same potential as the vacuum chamber and the anode. The interaction of the magnetic field with the electric field (E x B drift) causes the single electron trajectory to be three-dimensionally spiraled, rather than just moving around the target surface. As for the sputtering profile of the target surface type, it is that the magnetic field lines of the target source have a circumferential shape. Different directions of magnetic field lines will have a great relationship with film formation. Under the mechanism of (E×B shift), not only magnetron sputtering, but also multi-arc ion plating target source, ion source, plasma source, etc. work under this principle. The difference is the direction of the electric field, the magnitude of the voltage and current.
The basic principle of magnetron sputtering is to use the plasma in the mixed gas of Ar～02 under the action of electric field and alternating magnetic field, the accelerated high-energy particles bombard the surface of the target, and after the energy exchange, the atom on the surface of the target is detached. The lattice escapes and is transferred to the surface of the substrate to form a film.
Characteristics of magnetron sputtering: high film formation rate, low substrate temperature, good film adhesion, and large-area coating. The technology can be divided into: DC magnetron sputtering and RF magnetron sputtering.
Magnetron sputtering coating equipment adds magnetic field to the DC sputtering cathode target, uses the Lorentz force of the magnetic field to bind and prolong the trajectory of electrons in the electric field, increases the collision chance between electrons and gas atoms, and leads to the separation of gas atoms. The increase in the rate of the high energy ions bombarding the target and the bombardment of the high energy electrons of the plated substrate.
Third, the operation process
1. Clean the substrate with an ultrasonic generator, add the washing liquid during the cleaning process, clean it and dry it with a hot hair dryer. After drying, the substrate is tilted at a 45-degree angle. If there is no interference rainbow, the substrate is cleaned;
2. Place the substrate into the sample chamber;
3. After checking the water source, gas source and power supply, turn on the cooling water;
4. Vacuuming (according to the vacuuming operation procedure), after the pressure in the sputtering chamber reaches the limit;
5, the mechanical pump is still working, start to fill the Ar gas, turn the small mechanical pump front valve clockwise,
At the same time adjust the rotor flowmeter to a certain flow rate, so that the Ar gas pressure is 5-10.0Pa;
6. Press the = 7 \* GB3 7 sputter power red button on the “Control Panelâ€; turn on the DC magnetron sputtering power supply; follow the “JX-MSD DC Magnetron Sputter Power Supply Instruction Manualâ€;
7. Add a DC sputtering power supply between the two poles to sputter the substrate; according to the plating degree requirement,
Keeping the sputtering state for a certain period of time;
8. After the sample preparation is completed, turn off the DC magnetron sputtering power supply - mechanical pump - substrate heating (if open) - vacuum gauge;
9. Press the = 10 \* GB3 10 inflation valve green button on the “Control Panelâ€; the green light is on; the deflation valve is open and the deflation begins;
10. Repeated operation during the second batch of samples.
Fourth, thinking questions:
1. What types of magnetron sputtering coating machines are available?
2. What is the applicable range of magnetron sputtering coating?
Five, packing list
Serial number
Accessory name
Quantity
Serial number
Accessory name
Quantity
1
GTDM-1 type DC magnetron sputtering coating device
1
12
O-ring φ3×1.8
10
2
Mechanical pump (including inflation valve)
1
13
O-ring φ236×5.3
2
3
Glass bell
1
14
Bellows (KF25×800)
1
4
Substrate heating box and upper struts assembly
1
15
Flange KF25 with center ring O-ring
2
5
Upper struts support bar
2
16
Outer diameter φ16 water pipe
20 meters
6
Carrier chip
1 box
17
GTDM-1 DC Magnetron Sputtering Coating Equipment Instruction Manual
1 serving
7
Fixed wrench M8-10
1
18
JX-MSD DC Magnetron Sputtering Power Supply Instruction Manual
1 serving
8
Intake pipe nozzle sealing ring
2
19
AI-208 artificial intelligence temperature controller instruction manual
1 serving
9
Intake pipe nozzle sealing nut (304)
2
20
ZDR resistance vacuum gauge series instruction manual
1 serving
10
Intake pipe nozzle (304)
2
twenty one
Product certification
1 serving
11
O-ring φ5×2.65
2
twenty two
Packing List
1 serving
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