A flexible printed circuit board having lead portions for connection between circuit components is formed by stacking a plurality of substrates so that even when a resin having releasability is not applied to a surface where the substrates are in contact with each other, bending does not occur. Frictional sounds. In the flexible printed circuit board, concavities and convexities are provided on the surfaces of the substrates that are in contact with each other, and in particular, embossing is provided by polishing or embossing.


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